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User Guide: Information on how to install and use HotSpot can be obtained from this HotSpot-HOWTO. Please also see the FAQ, and check the archives of the mailing list. If these do not answer your questions, please post a question on the list, and we will try to respond within 2 business days.

Other publications related to HotSpot are listed below:

Improvements in version 6.0 are described here: Importance of modeling secondary heat transfer path (available in HotSpot 5.0) in special cooling solution is described here: Improvements in version 4.0 are described here: Greg Link's HS3d tool, from which v3.1 borrows its math acceleration engine, is described here: HotFloorplan, which is a part of HotSpot 3.0, is described here:
Validation against a thermal test chip and against an FPGA are described here: Improvements embodied in version 2.0 are described here:
The following paper gives a concise introduction to the temperature model. It also explains the various exploratory experiments that we did. More detailed information on the model and experiments are available in subsequent journal papers:

Other papers describing the early versions of the HotSpot model and our recent work using HotSpot can be found here.

This material is based upon work supported by the National Science Foundation under grant nos. CCR-0133634, CCR-0105626, EIA-0224434, CCF-0429765, CNS-0509245, and CNS-0551630, the Army Research Office under grant no. W911NF-04-1-0288, and grants from IBM, Intel, and the Univ. of Virginia Fund for Excellence in Science and Engineering. Any opinions, findings, conclusions, or recommendations expressed in this material are those of the authors and do not necessarily reflect the views of the sponsoring agencies.

Last updated: Jan. 23, 2019

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