HotSpot


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LICENSE
-------

LICENSE TERMS

Copyright (c)2003-2015. All rights reserved.

Permission is hereby granted, without written agreement and without license or
royalty fees, to use, copy, modify, and distribute this software and its
documentation for any purpose, provided that the above copyright notice and the
following four paragraphs appear in all copies of this software, whether in
binary form or not.

IN NO EVENT SHALL THE AUTHORS, THE UNIVERSITY OF VIRGINIA, OR THE STATE OF
VIRGINIA BE LIABLE TO ANY PARTY FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES ARISING OUT OF THE USE OF THIS SOFTWARE AND ITS
DOCUMENTATION, EVEN IF THEY HAVE BEEN ADVISED OF THE POSSIBILITY OF SUCH
DAMAGE.

THE AUTHORS, THE UNIVERSITY OF VIRGINIA, AND THE STATE OF VIRGINIA SPECIFICALLY
DISCLAIM ANY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. THE SOFTWARE PROVIDED
HEREUNDER IS ON AN "AS IS" BASIS, AND THE AUTHORS HAVE NO OBLIGATION TO PROVIDE
MAINTENANCE, SUPPORT, UPDATES, ENHANCEMENTS, OR MODIFICATIONS.

NEITHER THE NAME OF ANY VIRGINIA ENTITY NOR THE NAMES OF THE CONTRIBUTORS MAY
BE USED TO ENDORSE OR PROMOTE PRODUCTS DERIVED FROM THIS SOFTWARE WITHOUT
SPECIFIC PRIOR WRITTEN PERMISSION.

If you use this software or a modified version of it, we would appreciate it if
you would cite one of the following papers:

1) K. Skadron, M. R. Stan, W. Huang, S. Velusamy, D.  Tarjan, and K.
   Sankaranarayanan, "Temperature-Aware Microarchitecture." In Proceedings of
   the 30th International Symposium on Computer Architecture, June 2003

2) W. Huang, M. R. Stan, K. Skadron, K. Sankaranarayanan, S. Ghosh, and
   S. Velusamy, "Compact Thermal Modeling for Temperature-Aware Design." 
   In Proceedings of the 41st Design Automation Conference, June 2004.

3) K. Sankaranarayanan, S. Velusamy, M. R. Stan, and K. Skadron, "A Case 
   for Thermal-Aware Floorplanning at the Microarchitectural Level.",
   Journal of Instruction-Level Parallelism, June 2005.

4) W. Huang, K. Sankaranarayanan, R. J. Ribando, M. R. Stan, and K. Skadron,
   "Accurate, Pre-RTL Temperature-Aware Processor Design Using a Parameterized, 
   Geometric Thermal Model Considerations." IEEE Transactions on Computers, 
   57(9):1277-88, September 2008.

5) W. Huang, K. Skadron, S. Gurumurthi, R. J. Ribando, and M. R. Stan,
   "Differentiating the Roles of IR Measurement and Simulation of Power and 
   Temperature-Aware Design" In Proceedings of the 2009 IEEE International 
   Symposium on Performance Analysis of Systems and Software (ISPASS).
   April. 2009

6) R. Zhang, M. R. Stan, and K. Skadron, "HotSpot 6.0: Validation,
   Acceleration and Extension." University of Virginia, Tech. Report
   CS-2015-04



This material is based upon work supported by the National Science Foundation under grant nos. CCR-0133634, CCR-0105626, EIA-0224434, CCF-0429765, CNS-0509245, and CNS-0551630, the Army Research Office under grant no. W911NF-04-1-0288, and grants from IBM, Intel, and the Univ. of Virginia Fund for Excellence in Science and Engineering. Any opinions, findings, conclusions, or recommendations expressed in this material are those of the authors and do not necessarily reflect the views of the sponsoring agencies.

Last updated: June 18, 2015

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